EU remote
Electrical Engineer (Ground Control System)
About this role
About Us Harmattan AI is a next-generation defense prime building autonomous and scalable defense systems. Following the close of a $200M Series B, valuing the company at $1.4 billion, we are expanding our teams and capabilities to deliver mission-critical systems to allied forces. Our work is guided by clear values: building technologies with real-world impact, pursuing excellence in everything we do, setting ambitious goals, and taking on the hardest technical challenges.
We operate in a demanding environment where rigor, ownership, and execution are expected. Overview Harmattan AI is developing new hardware products within the GCS module, including ruggedised drone controllers and long-range RF systems designed for demanding field environments. These products require dedicated electronics design with complex architecture in a constrained environment – PCBs integrating RF modules, microcontrollers, power management, and communication interfaces – optimised for cost at volume.
The GCS team is seeking a dedicated hardware engineer to own electronics design end-to-end and accelerate the path to production milestones. Ideal candidate A senior hardware engineer who has designed and shipped complex PCBs, ideally mixing digital and power, into production. They are rigorous on schematics, layout, and bring-up, and have a strong instinct for cost and manufacturability. They are comfortable working autonomously in a small team and can bridge hardware and firmware.
Skills required PCB schematic and layout design (Altium Designer preferred) RF PCB design: controlled impedance, antenna matching, EMC management Mixed-signal design: power management, MCU interfaces, communication buses (SPI, I2C, UART, USB, CAN) Hardware bring-up and debug: bench equipment proficiency DFM/DFA for PCB manufacturing and assembly Component selection and BOM management Responsibilities: Schematic Design - Design complete schematics for mixed-signal and RF boards, from power to digital and RF sections.